| 摘要 |
The present invention relates to a probe stylus 1 for an inspection of semiconductor device in a state of wafer. When a large number of pad 5 are disposed in a semiconductor device, setting of the probe styluses 1 onto a probe card, on which a semiconductor to be inspected shall be mounted, is difficult. An objet of the present invention is to improve the form of the probe stylus to solve this problem. The object is attained by a probe stylus according to the present invention. The probe stylus 1 is comprised of a first electrically conductive member 2, a second electrically conductive member 3, and an insulating member 4 disposed between the first and second electrically conductive members 2,3, wherein the first and second electrically conductive members 2,3 have a form of a needle and they form a single needle. In an embodiment, the first and second electrically conductive members have a half round cross section. In another embodiment, each of the first and second electrically conductive members has a resilient portion at their tip portion. In another embodiment, the first electrically conductive member is covered with the insulating member, and the insulating member is covered with the second electrically conductive member. In further another embodiment, a slit is disposed between the first and second electrically conductive members.
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