SEMICONDUCTOR FABRICATING EQUIPMENT AND METHOD FOR PERFORMING SEMICONDUCTOR PROCESS

摘要

PURPOSE: A semiconductor fabricating equipment and a method for performing a semiconductor process are provided to prevent an error of a semiconductor process by depositing uniformly a predetermined material on a wafer. CONSTITUTION: A process chamber(210) is formed with a process chamber cover and a process chamber body. A passing hole is formed in a center portion of the process chamber cover. The process chamber cover is combined with the process chamber body by a hinge. A plasma etch device(230) is installed in the process chamber(210) in order to etch a part of material deposited on a wafer(270). The plasma etch device(230) is formed with a cathode electrode plate, an anode electrode plate, and a power supply portion. A deposition device(220) is installed in the process chamber(210) in order to deposit a predetermined material on the wafer(270). The deposition device(220) is formed with a reaction gas supply portion, a connection tube for connecting the reaction gas supply portion with the plasma chamber cover, and a reaction gas injection nozzle. A deposition/etch control portion(240) is formed with a heater block and a power supply in order to control a deposition speed.