CONNECTION STRUCTURE FOR PLANE TRANSMISSION LINE, AND SEMICONDUCTOR CHIP HAVING THE PLANE TRANSMISSION LINE AND MOUNT BOARD

摘要

PROBLEM TO BE SOLVED: To connect plane transmission lines formed on two dielectric materials with different dielectric constants. SOLUTION: In the case of connecting the plane transmission lines formed on two dielectric materials with different dielectric constants, a dielectric material thin film is formed only in the vicinity of the connected part and a line pattern is formed on the thin film. Thus, the effective dielectric constant of the connected part can be adjusted to have a desired value so as to relax a scale gap between the line on the mounted board and the line on a semiconductor chip. Thus, the impedance is easily matched to adopt a connection structure with a low reflection and a low loss.