发明名称 |
POSITIVE TYPE PHOTORESIST COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a positive type photoresist composition which ensures improved line edge roughness and suppressed occurrence of development defects in the production of a semiconductor device. SOLUTION: The positive type photoresist composition contains a resin containing specified repeating structural units and having a velocity of dissolution in an alkali developing solution increased by the action of an acid and a compound which generates the acid when irradiated with active light or radiation. |
申请公布号 |
JP2002031890(A) |
申请公布日期 |
2002.01.31 |
申请号 |
JP20000215574 |
申请日期 |
2000.07.17 |
申请人 |
FUJI PHOTO FILM CO LTD |
发明人 |
SATO KENICHIRO |
分类号 |
G03F7/039;C08F16/12;C08F16/36;C08F20/10;C08F28/04;C08F32/00;C08K5/00;C08K5/16;C08L45/00;C08L101/00;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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