| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for achieving a semiconductor element which can connect the electrode of the semiconductor element and a circuit of a circuit board with high reliability. SOLUTION: The method includes the steps of forming a hole 8 on a part of a circuit board 4, a part connecting a circuit 5 (copper foil) 5 formed on a surface of the circuit board 4 and an electrode 2 of a semiconductor element 1, a step of filling conductive paste 7 in the hole 8 to form an external electrode terminal 6, a step of positioning the external electrode terminal 6 and a protruding bump 3 formed on the electrode 2 of the semiconductor element 1 from the surface of the circuit board 4 on which the circuit 5 is formed, and the step of pressing the semiconductor element 1, bringing the protruding bump 3 and the conductive paste 7 in the hole 8 into contact with each other, and electrically connecting the electrode 2 of the semiconductor element 1 and the external electrode terminal 6 of the circuit board 4. |
