发明名称 |
Semiconductor device and production method thereof |
摘要 |
A semiconductor device that makes it possible to restrain the increase of the junction capacitance and others while preventing the punch-through and others accompanying the scale reduction, and a production method thereof are obtained. The semiconductor device includes source and drain regions of first conductivity type disposed to sandwich a channel region, and a pair of pocket injection regions of second conductivity type that cover only a neighborhood of side surface parts of the source and drain regions on the channel region side and respectively form a junction only between the neighborhood of the side surface parts and the pocket injection regions.
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申请公布号 |
US2002011635(A1) |
申请公布日期 |
2002.01.31 |
申请号 |
US20000735656 |
申请日期 |
2000.12.14 |
申请人 |
ABE YUJI;MIURA NARUHISA;SUGIHARA KOHEI;OISHI TOSHIYUKI;TOKUDA YASUNORI |
发明人 |
ABE YUJI;MIURA NARUHISA;SUGIHARA KOHEI;OISHI TOSHIYUKI;TOKUDA YASUNORI |
分类号 |
H01L29/78;H01L21/336;H01L21/8238;H01L27/092;(IPC1-7):H01L31/119;H01L31/113;H01L29/94;H01L31/062 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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