| 摘要 |
PURPOSE: A bonding option circuit is provided to simultaneously check an operation of X8 package product using X16 package product. CONSTITUTION: A determination circuit(25) determines X8 or X16, and a bonding pad(23) is connected to the determination circuit(25). A resistor(24) is connected to a connection node(N1) between the bonding pad and the determination circuit. A lead frame(21) of a ground voltage is connected to the bonding pad(23) through a bonding wire(22). An NMOS transistor(26) has a drain terminal connected to the connection node(N1) and a source terminal connected to ground voltage(VSS). A test mode circuit(27) is connected to a gate of the NMOS transistor(26). At testing X8, a user sets the NMOS transistor to the ground(VCC) with operating X8 by a test mode. |
