PLASMA TREATING METHOD AND PLASMA TREATING SYSTEM

摘要

PROBLEM TO BE SOLVED: To perform plasma treatment to plural reaction vessels with different impedance with high efficiency and at a low cost. SOLUTION: Movable reaction vessel parts 101, 151 and 161 have reaction vessels 104, 154 and 164 in which, respectively, the substrates to be treated are set to the insides, and impedance is different. Each reaction vessel 104, 154 and 164 is connected with a high frequency introducing means having a high frequency power source 111 and a high frequency matching apparatus 112', and, by the introduction of high frequency electric power, plasma treatment is performed to the substrates to be treated. The movable reaction vessel parts 101, 151 and 161 are respectively provided with matching circuit units 101U, 151U and 161U for controlling the impedance on the sides of the reaction vessels 104, 154 and 164 and on the sides of the high frequency introducing means.