发明名称 |
Verfahren zur Herstellung einer sehr dicken Dickschicht zur Kontrolle der thermischen und stromführenden Eigenschaften von Hybridschaltungen |
摘要 |
Disclosed is an ultra-thick thick film (30) of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate (32). A substrate (32) of suitable thickness is chosen to dissipate heat in the vertical, i.e., z-direction, underneath a heat-generating component such as a semiconductor chip (26). The ultra-thick films (30) have a thickness ranging from about 50.8 mu m (2 mils) to about 127 mu m (5 mils) and are prepared from metal powders having average particles sizes ranging from about 1 micrometre to 3 micrometres. <IMAGE> |
申请公布号 |
DE69428070(T2) |
申请公布日期 |
2002.01.31 |
申请号 |
DE1994628070T |
申请日期 |
1994.03.07 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
MYERS, BRUCE ALAN;KOLLIPARA, ANIL KUMAR;SARMA, DWADASI HARE RAMA;PALANISAMY, PONNUSAMY |
分类号 |
H01L21/52;H01L23/12;H01L23/373;H05K7/06;H05K7/20 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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