NON-BAKING HOT-MELT ADHESIVE PREPARATION

摘要

The invention relates to a hot-melt adhesive preparation, containing 25 to 99.5 wt. % of a thermoplastic polymer with a melting range between 40C and 250C, 0 to 40 wt. % of a resin for reinforcing the adhesive force of the preparation, 0 to 40 wt. % of a wax for regulating the viscosity of the preparation and 0 to 5 wt. % of additives usually used in hot-melt adhesives. According to the invention, 0.1 to 5 wt. % of a tenside is added to prevent the preparation from decomposing in dispensing and applying equipment.