| 摘要 |
PROBLEM TO BE SOLVED: To provide a partially plating device for a lead frame which, comprising a peeling/removing part which peels/removes a non-plated part, copes with mass production for partially plating a specified part of the lead frame, and to provided a method for partially plating the lead frame which copes with mass production for peeling/removing the non-plated part with no effect on quality. SOLUTION: The partially plating device which partially plates a specified part of the lead frame is provided with a non-plated part peeling part where, after a partially plating part or partial plating, there are sequentially provided a masking tape pasting part where a masking tape is so pasted as to cover a required plating part, a plate peeling/removing part for peeling/removing an unrequired plated part, and a masking tape peeling part or peeling the masking tape. |
