| 摘要 |
PROBLEM TO BE SOLVED: To assure a heat conduction path between a fin and a case with a simple configuration, related to a semiconductor device where a ceramics board on which a semiconductor element is mounted and a fin for radiating the ceramics board are housed in a case with the fin contacting the case for clamping. SOLUTION: A sawtooth protruding part 11 is formed on any one surface of a contact surface of a fin 3 against a case 4 and a contact surface of the case 4 against the fin 3. Clamping between the fin 3 and the case 4 allows contact to a contact surface of counterpart while the tip of the protruding part 11 is collapsed. |
