发明名称 FLOOR-HEATING PANEL AND PERIPHERAL PANEL LAID AT NON- FLOOR HEATING PART AROUND FLOOR-HEATING PART
摘要 PROBLEM TO BE SOLVED: To provide a floor-heating panel with improved soundproof performance and a peripheral panel, that is laid at a non-floor heating part around a floor-heating part that improves the execution property of the floor-heating panel, at the same time, inhibits the increase in manufacturing costs, and to provide a plurality of heating means connection parts according to a room to be laid. SOLUTION: The plurality of floor heating panel 8, etc., for composting the floor-heating part 7 are laid directly on a floor foundation plate 6 that is laid at a floor part 5. The plurality of peripheral panels 9, etc., for joining the thickness together with that of the floor-heating panels 8, while being composed by nearly the same material as the floor-heating panel 8 are, laid at the non-heating part around the floor-heating part 7. A irregular shape 14 is formed on a surface 12b that faces an uneven absorption layer among them.
申请公布号 JP2002031359(A) 申请公布日期 2002.01.31
申请号 JP20000216084 申请日期 2000.07.17
申请人 SEKISUI CHEM CO LTD 发明人 YAMAMOTO SATORU
分类号 E04F15/18;F24D3/16;F24D19/00;F24D19/06;(IPC1-7):F24D3/16 主分类号 E04F15/18
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