| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition system, by which a vapor deposition material can be efficiently utilized without providing a means of recovering the vapor deposition material and also the discharge and stoppage of the vapor deposition material can be switched in a short period of time. SOLUTION: The vapor deposition system 1 comprises an evaporation source 3 for heating and evaporating the vapor deposition material, a discharge part 4 for discharging the evaporated vapor deposition material into a film deposition chamber 2, a transfer part 5 for transferring the vapor deposition material from the evaporation source to the discharge part by means of vapor, and a substrate 6 attached in the position facing the discharge part in the film deposition chamber. The vapor deposition material discharged from the discharge part is made to fly to the substrate to deposit a thin film on the substrate. In the system, a valve 8 is provided to the transfer part to control the transfer of the vapor deposition material.
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