METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology for fabricating a high performance opto electronic device using a plastic support. SOLUTION: A first fixed substrate 101 and an element forming substrate 103 of resin are stuck through a first adhesion layer and then a semiconductor element and a light emitting element are formed on the element forming substrate. A second fixed substrate 106 of resin is then stuck onto the light emitting element through a second adhesion layer 107. Subsequently, it is irradiated with YAG laser under that state thus removing the first adhesion layer 102 and separating or stripping the first fixed substrate 101.