| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing device or processing inspection and the like without deterioration in throughput. SOLUTION: A handler 4 sequentially takes a wafer out of a cassette of a loader part 2, and the wafer number of the wafer is read by a print reading part 3. The wafer, bearing a specific number for inspection, is carried into an inspection part 1 for inspection. During the inspection, the wafer numbers of wafers which are not to be inspected are read sequentially by the print reading part 3, and the wafers housed in the cassette are rearranged, so that the wafer numbers are in the prescribed order. Since the time required for reading the wafer number is shorter than the inspection time, all the wafers housed in the cassette are rearranged, while only several wafers are inspected, resulting in shorter total process time required for rearrangement and inspection. |
