| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which avoids troubles due to the waveform of a specified chip to allow different power waveforms to be applied and the Iddq test to be conducted for the specified chip to improve the module quality. SOLUTION: A multi-chip module 1 mounts a plurality of chips having different functions and modules and packages them. It is composed of a flash memory 2, SRAM chip 3, microcomputer chip 4, etc., the flash memory 2 has a limit to the power start waveform, a power voltage of the same potential as that of the other chips 3, 4 is separated and connected to a power source pin Vcc1 (Vss1), and the SRAM and microcomputer chips 3, 4 have no limit to the power start waveform and are connected to a power source pin Vcc2 (Vss2). |
