| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor chip 8 on a glass epoxy substrate 5 and to fit it to a radiator at need at a CSP semiconductor device without requiring a substrate mounting process for the semiconductor chip 8 for an expensive adhesive. SOLUTION: A gap is formed between the semiconductor chip 8 and glass epoxy substrate to be adhered and molten resin enters the gap in resin sealing to form an adhesion layer 4a. Heat radiation effect increases by providing a metallic mount plate 2 which has good heat conductivity on the back surface of the semiconductor chip 8, and this is applicable to a large-sized array. |
