SEMICONDUCTOR WAFER AND DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer for flip-chip mounting, which has its circuit pattern shielded from light and can be polished to a thickness of about 100μm by a conventional mechanical method, so that the polished wafer has nearly the same strength with a wafer of about 200μm in thickness. SOLUTION: This semiconductor wafer includes a wafer and a plate material stuck right on the circuit formation surface of the wafer with an adhesive.