发明名称 ELECTROPLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electroplating apparatus capable of reducing the cost of a power supply facility, and realizing the current running in cathode side electrodes to be as constant as possible. SOLUTION: This electroplating apparatus comprises a plating tank (1) with a plating solution stored therein, a plurality of cathode side electrodes (3), a common anode side electrode disposed common to the cathode side electrodes (4), a plurality of supporting pieces (26) disposed on each cathode side electrode so as to support a work (16) to be plated, a current control means (6) which is provided on each cathode side electrode to control the output current to be constant with a positive output terminal connected to the common anode side electrode and a negative output terminal connected to the corresponding cathode side electrode, and a transformer (8) which is provided common to a plurality of current control means, and supplies the power from an AC power source to each current control means.
申请公布号 JP2002030492(A) 申请公布日期 2002.01.31
申请号 JP20000220474 申请日期 2000.07.21
申请人 SAGINOMIYA SEISAKUSHO INC 发明人 MAEKAWA KOJI;KANEKO TOSHIO
分类号 C25D7/00;C25D13/00;C25D17/08;C25D21/10;(IPC1-7):C25D17/08 主分类号 C25D7/00
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