| 摘要 |
Heat is removed from an equipment enclosure using a recirculating air flow loop that is confined entirely within the enclosure. A segment of the air flow loop is directed onto heat-generating components, contained within housings mounted inside the enclosure. A segment of the air flow loop carries heated air to a heat exchanger, which transfers heat to flowing liquid. A portion of the air flow loop traverses through the ductless air volume confined between the housings and inner walls of the enclosure. Blowers to drive the air flow are typically mounted within or on a housing. Heat exchangers are also typically mounted on a housing. Embodiments of the present invention enable a single heat exchanger or multiple heat exchangers to cool multiple electronic components without complicated ducting and without exhausting heated air into a controlled manufacturing environment, e.g. a clean room.
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