| 发明名称 |
Single-point bonding apparatus |
| 摘要 |
In a single-point bonding apparatus that connects the end portions of leads or the cut end portions of leads to pads respectively by pressing such end portions of leads or cut end portions of leads with a tool, a cleaning stage that is used to clean the tool is additionally provided, and a cleaning chip is disposed on the surface of the cleaning stage.
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| 申请公布号 |
US2002011313(A1) |
申请公布日期 |
2002.01.31 |
| 申请号 |
US20010915617 |
申请日期 |
2001.07.26 |
| 申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
SUGIURA KAZUO;TAKAHASHI KOICHI;SHIOZAWA SHIGERU |
| 分类号 |
H01L21/60;H01L21/00;(IPC1-7):B32B1/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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