发明名称 |
Positive photoresist composition |
摘要 |
A positive photoresist composition is disclosed, comprising a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, and a compound capable of generating an acid upon irradiation with actinic rays or radiation.
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申请公布号 |
US2002012866(A1) |
申请公布日期 |
2002.01.31 |
申请号 |
US20010838257 |
申请日期 |
2001.04.20 |
申请人 |
NISHIYAMA FUMIYUKI;FUJIMORI TORU;TAN SHIRO |
发明人 |
NISHIYAMA FUMIYUKI;FUJIMORI TORU;TAN SHIRO |
分类号 |
G03F7/004;G03F7/039;(IPC1-7):G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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