发明名称 Positive photoresist composition
摘要 A positive photoresist composition is disclosed, comprising a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, and a compound capable of generating an acid upon irradiation with actinic rays or radiation.
申请公布号 US2002012866(A1) 申请公布日期 2002.01.31
申请号 US20010838257 申请日期 2001.04.20
申请人 NISHIYAMA FUMIYUKI;FUJIMORI TORU;TAN SHIRO 发明人 NISHIYAMA FUMIYUKI;FUJIMORI TORU;TAN SHIRO
分类号 G03F7/004;G03F7/039;(IPC1-7):G03F7/004 主分类号 G03F7/004
代理机构 代理人
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