发明名称 |
CURVED CHIP ON RIGID SUPPORT TO BE MOUNTED REMOVABLE ON AN APPLIANCE |
摘要 |
The invention concerns a method for making a portable smart object, which consists in transferring a chip (2) on a rigid final support (22; 50; 84), on part of the surface of said support (22; 50; 84) previously or subsequently comprising a curvature and/or several surfaces (84a; 94b; 84c). Typically, the chip has a thickness of the order of 10 mu m. |
申请公布号 |
WO0209168(A1) |
申请公布日期 |
2002.01.31 |
申请号 |
WO2001FR02357 |
申请日期 |
2001.07.19 |
申请人 |
GEMPLUS;PATRICE, PHILIPPE;CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE |
发明人 |
PATRICE, PHILIPPE;CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE |
分类号 |
G06K19/077;H01L21/58;H01L23/13;H01L23/498;H01L29/06 |
主分类号 |
G06K19/077 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|