发明名称 CURVED CHIP ON RIGID SUPPORT TO BE MOUNTED REMOVABLE ON AN APPLIANCE
摘要 The invention concerns a method for making a portable smart object, which consists in transferring a chip (2) on a rigid final support (22; 50; 84), on part of the surface of said support (22; 50; 84) previously or subsequently comprising a curvature and/or several surfaces (84a; 94b; 84c). Typically, the chip has a thickness of the order of 10 mu m.
申请公布号 WO0209168(A1) 申请公布日期 2002.01.31
申请号 WO2001FR02357 申请日期 2001.07.19
申请人 GEMPLUS;PATRICE, PHILIPPE;CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE 发明人 PATRICE, PHILIPPE;CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE
分类号 G06K19/077;H01L21/58;H01L23/13;H01L23/498;H01L29/06 主分类号 G06K19/077
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