| 摘要 |
PROBLEM TO BE SOLVED: To lower the cost of a heat diffusing plate, to prevent a blow hole from being formed, a wire from corroding due to water, etc., and to improve the heat radiating characteristics of the heat-diffusing plate. SOLUTION: This semiconductor device has an external terminal provided on the reverse surface of a base material, a semiconductor chip connected to the top surface of the base material, and the heat-diffusing plate thermally connected to the semiconductor chip. The heat-diffusing plate is composed of a heat radiator thermally connected to the semiconductor chip and a support which is formed integrally with the heat radiator, and the support is provided partially a the periphery of the heat radiator and adhered to the base material. In this constitution, the heat-diffusing plate can be formed integrally through simple machining, so the manufacturing of the heat-diffusing plate is facilitated and the cost is reduced. Further, the inside of the heat-diffusing plate is opened, so no blow hole is formed and water, etc., sticking on the semiconductor chip can easily be removed to prevent the wire from corroding, etc. |
