| 摘要 |
The present invention is directed to a methodology, structure and process (200) for routing, connecting, and forming optical fibers between optical ports such as optical transmitters and receivers/detectors to create optical pathways for signal transfer therebetween. More particularly, when connecting timed optoelectronic chips on a Multi Chip Module, an optical fiber is aligned above an optical port (202), the fiber and the port surface are heated (204), (206) and contacted (208) creating an adhesion bond therebetween. The fiber is then routed (210) to another optical port for connection (214). The fiber may then be connected to additional ports (218) or severed (220). Once severed, the optical pathway may be adjusted to synchronize timing between optoelectronic chips. If a chip's timing is advanced or delayed, the connecting optical pathway may be lengthened (224) or shortened (226). Last, the optical fibers are annealed (228) to relieve internal stresses and cure surface defects. |
