| 发明名称 |
EMI SHIELDING ENCLOSURES |
| 摘要 |
<p>An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.</p> |
| 申请公布号 |
EP1075781(B1) |
申请公布日期 |
2002.01.30 |
| 申请号 |
EP19990914309 |
申请日期 |
1999.03.31 |
| 申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
YENNI, DONALD, M., JR.;DE SOUZA, JOSE, P.;BAKER, MARK, G. |
| 分类号 |
H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H05K9/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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