| 摘要 |
The device (100) has an elongated body (110) with opposing first and second major surfaces (120,130) and opposing first and second minor surfaces (140,150). In order to mount the device to a substrate, a mounting recess (155) extends along the length of the second minor surface. A first ledge (125) extends from the first major surface (120) and defines a first component mounting area (121) of a first lateral dimension. A second ledge (135) extends from the second major surface (130) and defines a second component mounting area (131) of a second lateral dimension. The first lateral dimension differs from the second lateral dimension so that two different sizes of heat generating components can be mounted on the heat transfer device. |
