Method of manufacturing a capacitive signal transfer device between the chip layers of a vertical integrated circuit

摘要

The capacitive signal transmission device uses a coupling capacitor (Ck) to provide a defined signal transmission path between parts of the circuit contained in vertically spaced layers (Ln+1). The latter layers respectively contain a transmitter (S) and a receiver (E), coupled together by the coupling capacitor. Pref. the coupling capacitor has relatively insulated lateral electrodes (EL1,EL2) respectively incorporated in the coupled circuit layers, the receiver pref. comprising a comparator with a hysteresis characteristic.