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发明名称
INTEGRATED CIRCUITS WITH COPPER MATALLIZATION FOR INTERCONNECTIONS
摘要
申请公布号
KR20020007409(A)
申请公布日期
2002.01.26
申请号
KR1020017014460
申请日期
2001.11.13
申请人
发明人
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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