| 摘要 |
PROBLEM TO BE SOLVED: To obtain a CSP-type semiconductor device, in which connection reliability in enhanced with a solder ball 3 mounted on a wiring board being protected against rupture, even if there is a temperature rise during its operation. SOLUTION: In order to prevent a substrate attempting to thermally expand from being restricted by a chip 1, slits 7a, 7b are made into cross shape in the substrate, which is thereby divided into substrates 2a, 2b, 2c and 2d, thus reducing thermal stresses applied to a solder ball 3 which is located between the substrate and a wiring board. |
