| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming solder bumps suitable for an IC chip inexpensively, and a method for manufacturing a semiconductor device. SOLUTION: An opening 6 is made in an inexpensive photoresist 5 having low heat resistance formed on a wafer 1, and only a solder paste 9 filling that opening 6 is heated locally with laser light 16 to form a solder bump 10. According to the method, solder bumps 10 of a specified quantity can be formed with no variation in the openings 6 made with a high accuracy and a method for forming solder bumps at a low cost through use of an inexpensive photoresist can be provided. |
