| 摘要 |
<p>PROBLEM TO BE SOLVED: To transfer a wafer without damaging it. SOLUTION: In the semiconductor device manufacturing method a wafer 42, mounted and held on a support 28 at the arm top end of a transfer robot 20, is transferred between a cassette 3 for housing a plurality of wafers laminated and mutually separated, and a process jig 30 for housing plurality of wafers laminated and mutually separated. The method comprises a step of detecting the positional of a wafer to be transferred and the positional relation of units around it, using a shape recognizer, a step of controlling the transfer robot 20, based on the detected information to hold the wafer to be transferred on the support, a step of detecting the position for housing the wafer to be transferred and the positional relation of units around it, using a shape recognizer, and a step of controlling the transfer robot to house the wafer to be transferred at a prescribed position.</p> |
