发明名称 |
ELECTRIC AND ELECTRONIC CHIP COMPONENT STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To tightly solder electric and electronic chip components to a circuit board. SOLUTION: At the outer periphery of an electrode 2, a ring-shaped electrode 3 is provided with a gap S, and the electrode and a land 5 of the circuit board 4 are soldered so that solder 6 reaches a dummy electrode 3.
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申请公布号 |
JP2002026066(A) |
申请公布日期 |
2002.01.25 |
申请号 |
JP20000200508 |
申请日期 |
2000.07.03 |
申请人 |
MITSUBA CORP |
发明人 |
YAMADA HIROSHI;NAGASE YUICHI |
分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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