发明名称 ELECTRIC AND ELECTRONIC CHIP COMPONENT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To tightly solder electric and electronic chip components to a circuit board. SOLUTION: At the outer periphery of an electrode 2, a ring-shaped electrode 3 is provided with a gap S, and the electrode and a land 5 of the circuit board 4 are soldered so that solder 6 reaches a dummy electrode 3.
申请公布号 JP2002026066(A) 申请公布日期 2002.01.25
申请号 JP20000200508 申请日期 2000.07.03
申请人 MITSUBA CORP 发明人 YAMADA HIROSHI;NAGASE YUICHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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