发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a highly sensitive movable part. SOLUTION: The movable part of semiconductor can be increased in mass, rigidity, and structural strength by plating. A semiconductor device in which only the wall surface of an etched hole is plated can be easily formed by the use of a SOI substrate. |
申请公布号 |
JP2002026338(A) |
申请公布日期 |
2002.01.25 |
申请号 |
JP20000203612 |
申请日期 |
2000.07.05 |
申请人 |
TOYOTA CENTRAL RES & DEV LAB INC |
发明人 |
FUJITSUKA TOKUO;TSUKADA ATSUSHI;MIZUNO KENTAROU |
分类号 |
G01P9/04;B81B3/00;B81C1/00;G01C19/56;G01P15/125;H01L29/84 |
主分类号 |
G01P9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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