| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat treatment equipment which enables to prevent an incomplete heating and to transport a substrate smoothly even if a misregistration occurs. SOLUTION: The heating and cooling treatment apparatus 43 is provided with a hot plate 72 mounting a wafer W, a first supporting pin 77 movable up and down which absorbs by an absorbing opening 80 the wafer W received from the main transportation system 13 at a transporting position P1 and mounts the wafer W onto a heating position P2 on the hot plate 72, a cooling plate 91 which mounts the wafer W to cool, and position sensors 100, 101 which detect the position of the wafer W before transporting it.</p> |
