| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling fluid cooling type semiconductor device which is excellent in cooling effect and easy of assembling irrespective of irregularity of manufacturing dimension of the device. SOLUTION: A semiconductor module 1 is interposed between flat cooling tubes 2, 2 whose both ends are linked with a pair of headers, and the flat cooling tubes are pinched with an U-shaped plate spring member 4. Both end portions of the flat cooling tubes 2 are easily transformed in the direction of the thickness of the semiconductor module 1, so that contact property between the flat cooling tubes 2 and the semiconductor module 1 is improved. |
