| 摘要 |
PROBLEM TO BE SOLVED: To provide a module for reducing costs by simplifying a manufacturing process. SOLUTION: The arrangement of pins 6 in a module 1 is formed in conformity with the arrangement of a connection pin in an all-purpose pin grid array type IC chip. As a result, by an automatic assembly machine that is set to the pin arrangement of the all-purpose IC chip, the pin 6 can be connected to the module 1, thus simplifying the manufacturing process and reducing costs. Also, a pin 6 located at the second row from the outermost periphery is used as a signal pin 6A out of the pins 6, and the pins 6 located at the outermost periphery and at the third row from it are used as grounding pins 6B. In this manner, by arranging the signal pin 6A so that it can be surrounded by the grounding pin 6B, the radiation noise between the adjacent signal pin 6A and surrounding electronic components can be reduced.
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