| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem such that mounting strength becomes weak and mounting reliability is deteriorated since a plating layer does not exist in the end face of a lead and a solder fillet is not formed when a resin sealed semiconductor device commodity is bonded to a mounting board such as a printed board by solder and the like in a single-sided sealing package where a lead frame is used and electrodes are arranged in an array shape. SOLUTION: The lead end face 9 of the lead 4 exposed from sealing resin 8 has a plating layer 15. Specifically, if has a plating layer except for a part of the upper part of the end face. Thus, the solder fillet 18 is formed in the lead end face 9 of the lead 4 when bonding it to the mounting board such as the printed board by solder. Consequently, mounting strength is improved and mounting reliability can be improved.
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