| 摘要 |
PROBLEM TO BE SOLVED: To provide a microminiature package, whose structure is improved so that it can be protected from breakdowns which damage its functions, even when a board for electronic components is bent by exerting to the board an abnormally strong operating force such as key-operating force. SOLUTION: When a plurality of key contacts 4 are held on one surface of a board 3 for electronic components and a microminiature package 5 is held on its other surface, a member 6 forming the microminiature package 5, which covers a silicon chip 11, is provided on a ceramic surface 10 of the microminiature package 5 via an air gap 12.
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