| 摘要 |
The invention concerns a method for making integrated circuit chips, characterised in that it comprises a step which consists in selectively coating an adhesive reinforcing material (13) over the whole active surface of a wafer of integrated circuits before separating the chips (10) excluding the contact pads (11) of each chip (10), The selective coating may be carried out before or after forming the bosses (12) on the contact pads (11), by screen printing or material spraying. |
