| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that conventionally an automatic bonder cannot accurately recognize the position of a wiring layer due to low reflectance of gold plated layer formed on the surface of the wiring layer. SOLUTION: The wiring board comprises an insulating substrate 1, a wiring layer 5 of a metallic material principally comprising copper formed at least on the surface of the insulating substrate 1 and connected with the electrode of an electronic component 3 via a bonding wire 7, and a god plating layer 9, formed on the surface of the wiring layer 5 where the reflectance of the gold plating layer 9 is 40% or above. |
