RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To sufficiently take the strength of a die pad part while a resin sealed semiconductor device can be thinned and to overcome a problem such as the deformation of the die pad part. SOLUTION: The resin sealed semiconductor device has the die pad part 2 mounting a semiconductor chip 1 and the opposite face of the semiconductor chip mounting side of the die pad part 3 is covered by resin except for at least three exposure parts 8.