发明名称 CONNECTION STRUCTURE OF WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To easily connect a wiring board to various types of connection objects. SOLUTION: A plurality of wire connection grooves 35 are formed on a wiring board 24 on which wires 33 are arranged in a matrix form in a direction perpendicular to the arrangement direction of the wires 33. The grooves 35 are formed, so as to correspond to a pitch of compression connection parts of various type of a connection object, i.e., a pitch D of compression connection parts 42 of an electronic unit 25, etc., arranged selectively in an electrical junction box 24.</p>
申请公布号 JP2002027634(A) 申请公布日期 2002.01.25
申请号 JP20000200752 申请日期 2000.07.03
申请人 YAZAKI CORP 发明人 SEKI YOSHINOBU
分类号 H01R4/24;H01R9/03;H02G3/16;(IPC1-7):H02G3/16 主分类号 H01R4/24
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