Solder cream re flowing or glue polymerisation for fixing surface mounted components on electronic cards using a gas with high conducting power and high heat capacity

摘要

Solder cream re flowing or glue polymerisation for fixing components on an electronic card (1) uses a gas (36) having a conducting power greater than 0.04 W.m<-1>.K<-1> and a heat capacity greater than 1.5KJ.Kg<-1>.K<-1> circulating in a chamber and acting as a coupler and heat carrier due to its high thermal conductivity and high heat capacity relative to all other gases normally used in such applications. An Independent claim is included for the device putting this method of solder cream re flowing or glue polymerisation.