发明名称 SEALING METHOD FOR ORGANIC EL ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a sealing method for an organic EL element to prevent generation of poor workmanship of sealing by eliminating pressure rise in the sealing space, at adhesion through a simple procedure. SOLUTION: The sealing space, in communication with the external space at a seam 21, is partitioned by an unhardened bonding agent 2, having a seam 21 and is provided ring-shapedly and a transparent base board and sealing member 1 put in pressure attachment with the bonding agent 2 interposed; the portion of bonding agent 2b at the continuing part as elsewhere than the bonding agent 2a at the seam part is hardened, while the seam part bonding agent 2a including the seam 21 among the unhardened bonding agent 2 is left; and thereafter the seam part bonding agent 2a is hardened and the seam 21 is blocked with its volume expansion. An example of bonding agent 2 is an ultraviolet hardening type. The gas expanded with the temperature rise associated with ultraviolet irradiation, etc., for hardening the continuing part bonding agent 2b is released from the seam 21 to the external space, so that the sealing space and external space can be kept at an equal pressure.
申请公布号 JP2002025764(A) 申请公布日期 2002.01.25
申请号 JP20000204075 申请日期 2000.07.05
申请人 TOYOTA MOTOR CORP 发明人 OSANAWA KENJI
分类号 H05B33/04;H01L23/02;H01L23/10;H01L51/50;H01L51/52;H05K5/06;H05K7/12 主分类号 H05B33/04
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