| 摘要 |
PROBLEM TO BE SOLVED: To simply form wiring between terminals of a special structure. SOLUTION: A unit block 39 is positioned in a recess 54 of a glass substrate 52 to form a structure K. On a surface of the structure K, terminals 39A and 39B of the unit block 39 and terminals 52A and 52B directly formed on the substrate 52 are exposed. A film 1 made of polyvinylpyrrolidone is formed on the surface of the structure K and through-holes 10 are made at positions corresponding to the terminals 52A and 52B. A liquid 7 having copper fine particles dispersed in a solvent therein is continuously discharged from a head 2 of an injector to cover a range of the film 1 from the through-hole 10 on the terminal 52A to the through-hole 10 on the terminal 39A. The structure is next heated.
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