SUBSTRATE PROCESSING METHOD AND DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resist separating technique which bas a high reaction rate, is clean, and causes less damage to a substrate. SOLUTION: An ozonized water 7 containing an acetic acid is continuously fed to the center of a substrate 1 as the substrate 1 is rotated. All the surface of the substrate 1 is irradiated with ultraviolet rays by the use of a UV lamp 3. The ozonized water 7 containing an acetic aid is made to flow over the surface of the substrate 1 as the surface of the substrate 1 is irradiated with ultraviolet rays, by which resist attached to the surface of the substrate 1 is efficiently removed.