发明名称 SOLID ELECTROLYTIC CAPACITOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor which has a structure for reducing thermal stress, prevents leakage current and exhibits a low impedance and high reliability. SOLUTION: With respect to the solid electrolytic capacitor device, which is provided with an anode consisting of an end of a valve action metal substrate cut into a prescribed shape and having a dielectric film on its surface, an insulating layer of a prescribed width around the valve action metal substrate and a cathode, made by forming a solid electrolytic layer and a conductive paste layer composed of a carbon paste layer and a conductive layer containing metal powder thereon in sequence over the whole surface located opposite to the anode of the substrate bordered by the insulating layer, the conductive layer containing the metal powder is provided in the region of the carbon paste layer and the conductive layer containing metal powder is also placed separated by a space to the end of the insulating layer on the side of the cathode.
申请公布号 JP2002025863(A) 申请公布日期 2002.01.25
申请号 JP20000207172 申请日期 2000.07.07
申请人 SHOWA DENKO KK 发明人 SAKAI ATSUSHI;FURUTA YUJI;YAMAZAKI KATSUHIKO;ICHIMURA TAKASHI
分类号 C08K3/08;C08L21/00;H01B1/12;H01G9/00;H01G9/028;H01G9/04;H01G9/15;(IPC1-7):H01G9/04 主分类号 C08K3/08
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