APPARATUS AND METHOD FOR FORMING BUMP, COMPUTER READABLE MEDIUM RECORDING PROGRAM FOR EXECUTING BUMP FORMING METHOD, AND SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for forming a bump in which bonding state can be stabilized between the electrode part and the bump while enhancing the bonding strength as compared with a prior art, a computer readable recording medium, and a semiconductor substrate on which bumps are formed. SOLUTION: A preheater 160 is provided and before a bump 16 is formed at an electrode part 15, a semiconductor substrate 201 is subjected to temperature control for accelerating bonding of the electrode part and the bump at the time of forming the bump. Since metal particles at the electrode part can be changed into an appropriate state before a bump is formed, bonding state of the electrode part and the bump can be enhanced phenomenally.